In exercise of the power conferred
by sub section (1) of section 25 of the Customs Act, 1962 (52 of 1962), the
Central Government, being satisfied that it is necessary in the public interest
so to do, hereby exempts the goods specified in column (3) of Table below, and
falling under the Chapters of the First Schedule to the Customs Tariff Act,
1975 (51 of 1975) specified in the corresponding entry in column (2) of the
said Table, when imported into India for use in the manufacture of the finished
goods specified in the corresponding entry in column (4) of the said Table, from
so much of that portion of the duty of customs leviable thereon which is
specified in the said First Schedule, as is in excess of the amount calculated
at the rate of,-
|
S. No
|
Chapter
|
Description of
imported goods
|
Description
of finished goods
|
|
(1)
|
(2)
|
(3)
|
(4)
|
|
1.
|
15, 29, 32, 34, 39, 48, 70
|
Alpha cellulose paper/ cotton
paper; Electrical grade craft paper, Tung oil; Volan/ Silane treated glass
fabric cloth
|
Copper clad laminates phenolic or paper
phenolic or glass epoxy types; composite type copper clad laminates; Printed
Circuit Boards. ��
|
|
2.
|
25, 28, 40, 56, 70, 84, 85
|
Potassium carbonate/ Potassium
Nitrate (Prilled); Barium carbonate; Pumice powder; Cerium oxide; Anode buttons;
Necks and Neck tubings; Wool felt; Spodumene
|
Glass shell/ parts of television
picture tube.
|
|
3.
|
25, 28, 40, 70, 84, 85
|
Strontium carbonate; garnet
powder; stud pins; Titanium dioxide; sodium antimonate; rubber sleeve
|
Glass shell/parts for colour
picture tubes.
|
|
4.
|
Omitted
|
|
5.
|
28
|
High purity gases:
Argon; halocarbon-14;
halcarbon-116; halocarbon-23; helium; silicon tetrachloride; sulphur
hexafluoride; chlorine; silane; hydrochloric acid; phosphine & silane
mixture; boron trichloride; dichlorosilane; diborane; hydrogen bromide;
phosphine in nitrogen; nitrous oxide; boron trifluoride; arsine & arsine
mixture; phosphine in hydrogen; hydrogen; nitrogen
|
Integrated circuits,
Semi-Conductor devices. ��
|
|
6
|
28, 29
|
High purity chemicals:
Acetic acid MOS/CMOS grade;
Sulphuric acid MOS/ CMOS grade; Hydrochloric acid MOS/ CMOS grade; Buffered
oxide etchant MOS/ CMOS grade; Ammonium fluoride MOS/ CMOS grade; Trichloroethylene
MOS/ CMOS grade; lsopropyl alcohol MOS/ CMOS grade; Acetone MOS/ CMOS grade;
Hydrofluoric acid MOS/ CMOS grade; Nitric acid MOS/ CMOS grade; Phosphoric
acid MOS/ CMOS grade; Hydrogen peroxide MOS/ CMOS grade
|
Integrated circuits, Semi-conductor
devices
|
|
7.
|
28, 29, 38, 76
|
Cadmium sulphide; cadmium
telluride; silicon dioxide; cadmium chloride; zinc telluride; indium;
germane; disilane; phosphine; hydrogen fluoride; aluminium sputtering target;
zinc oxide sputtering target; adhesive coated aluminium foil; high purity
hydrogen; high purity nitrogen; high purity argon; copper doped graphite
paste; high purity methane; diborane in high purity helium
|
Solar cell/ modules.
|
|
8.
|
28, 29, 32, 38, 39, 68, 74
|
Copper plating salts, their
brightners, levelers, conditioners, replenishers, stabilizers; Black Oxide
Coating (Micro-tech) solution/ salts, predip solution/ salts, palladium
catalyst solution/salts
|
Printed Circuit Boards.
|
|
9.
|
28, 29, 32, 38, 71
|
Resistive, Conductive,
Di-elective, Overglaze or solder pastes, compositions or inks in packing not
exceeding 20 kg
|
Hybrid Microcircuits;
potentiometers; Resistors (other than heating resistor); Ceramic and Mica
Capacitor; Conductive Rubber Switches/Key Boards. Thermistors.
|
|
10.
|
28, 29, 32, 39, 48, 69, 74,
85
|
Ceramic bodies (coated or
uncoated); bandoliering tape with or without adhesives; solder plated copper
wire of dia. upto 1 mm; solder plated brass wire of dia. upto 1 mm; high
melting point solder alloy; paper backed polyurethane tape; epoxy marking ink
with or without hardener/ thinner
|
Thermistors.
|
|
11.
|
28, 29, 34
|
Resist stripper
|
Semi-conductor devices, printed
circuit boards.
|
|
12.
|
28, 29, 34, 85
|
Special materials:
Surfactant, tetra
ethyl-ortho-silicate (TEOS); trimethyl borate (TMB); trimethyl phosphite
(TMPI); trichloroethane (TCA); dichloroethylene; sputtering targets; photo
resist primer; edge bead remover
|
Integrated circuits,
Semi-conductor devices.
|
|
13.
|
28, 29, 37,
|
Photo resist & associated
thinners or/and developers; photospin glass
|
Semi-conductor devices, printed
circuit boards.
|
|
14.
|
28, 29, 38,
|
Electrolyte
|
Etched or Formed Aluminium Foil,
Electrolytic Capacitors.
|
|
15.
|
28, 29, 38,
|
Dopants or doping sources in all
forms, and with or without precious metal constituents
|
Semi-conductor devices.
|
|
16.
|
28, 29, 38, 39
|
Epoxy/ Epoxide resins/ Epoxy
moulding powder, compounds or encapsulants; Fillers, thinners, hardeners,
accelerators and fire retardants
|
Capacitors; Semi-conductor
Devices; Light Emitting Diodes; Mounted Piezo Electric Crystal;
Liquid Crystal Displays; Electronic Valves and Tubes; Switches; Copper clad
laminates of glass epoxy/paper epoxy type; composite type copper clad
laminated; Delay lines; Line and Wave Traps; Potentiometers; Silicon
Crystals or Silicon wafers;
Connectors; Resistors (other than heating resistors); Deflection parts;
Loudspeakers; magnetic Heads; Paper Cones/Spiders/Dust Caps for Loudspeaker;
Hybrid Microcircuits; Printed parts�����
��
|
|
17.
|
28, 32
|
Ferric Oxide of purity of 99% and
above; Manganous Manganic Oxide with Manganese content 71% or
above; Manganese dioxide of purity of 99% and above;
Manganous Oxide Nickel Oxide; Strontium Carbonate
|
Ferrites.
|
|
18.
|
28, 38, 39, 70, 74, 76
|
Aluminum paste; ethylene vinyl
acetate sheets (EVA); primer for EVA; Crane glass; tedlar coated aluminium
sheet; phosphorous oxychloride; halo carbon (CF4)/ Freon gas; tinned copper
interconnect; toughened glass with low iron content and transmittivity of
min. 90% and above; multilayered sheets with tedlar base; fluro polymer
resin; ultra high purity(UHP) silane in UHP nitrogen; UHP silane; diborane in
UHP silane; MOCVD grade phosphine in UHP silane; silver sputtering target;
high purity tin tetrachloride; nitrogen�
trifluoride of 99% purity and above�
��
|
Solar cells/modules.
|
|
19.
|
28, 39, 68, 73
|
Blue steel lapping carriers/
lapping carriers; lapping vehicles; lapping abrasive powder, lapping compound
|
Mounted piezo-electric crystals;
Printed Circuit Boards; Semi-conductor devices; Potentiometers; Resistors
(other than heating resistors); Connectors; Switches; Relays; Tape deck
mechanism; Magnetic heads; Deflection parts; DC micromotor upto 13.5 V not exceeding
20 Watt rating; Silicon in all forms; LED lamps and displays
|
|
20.
|
28, 39, 81, 85
|
Tantalum powder, Tantalum wire; GM
Seals; Cans; Silver powder suspension; Manganese Nitrate; Heat shrinkable
polyester tubing
|
Tantalum capacitors
|
|
21.
|
28, 48, 69, 75, 78, 81, 84
|
Lead based ceramic composition;
Magnesium titanate based ceramic composition; Neodium based ceramic
composition; Aluminasetters/ slabs; Lint free paper/paper towels/filter paper,
Zirconia milling media/high alumina tumbling media; Steel shots-copper plated
hollow, Nickel and sulphonic acid based plating chemicals; Razer blades/
doctor blades
|
Ceramic dielectric (multi-layer)
capacitors.
|
|
22.
|
28, 68
|
Tantalum Neodyme oxide; Neodyme
oxide; Strontium carbonate
|
Ceramic Capacitors
|
|
23.
|
28, 70, 73, 75, 85
|
Crystal Holders, Bases, covers;
Glass Bulbs; Glass Bases; Nickel Eyelets; Springs; Solder wire 25 SWG or
thinner; Chromium Pellets
|
Mounted Piezoelectric crystals
|
|
24.
|
28, 81
|
Tungsten rhenium wire; Suspension
of aluminium oxide in binder; Suspension of tungsten powder and aluminium
oxide in binder, Triple carbonate suspension of calcium, barium strontium in
binder
|
Electron guns and electron gun
parts
|
|
25.
|
29
|
Tetra Bromo Bisphenol-A;
Tricresyl/ Aryl Phosphate
|
Copper clad laminates for Printed
Circuit Boards. ��
|
|
26.
|
32
|
Electron Phosphor
|
Electronic Valves and Tubes.
|
|
27.
|
32
|
Desmearing agents
|
Printed Circuit Boards
|
|
28.
|
32, 35, 39
|
Silicone based resins, oils,
varnishes, lacquers, elastomers, with or without additives
|
Semi-conductor Devices; Liquid Crystal
Displays; Electronic Valves and Tubes; Resistors (other than heating
resistors); Connectors; Magnetic Tape; Relays; Potentiometers; Switches;
Capacitor grade metallised plastic film; Piezoelectric crystal; Hybrid Micro
circuits.� ��
|
|
29.
|
32, 37, 39
|
Solder Mask/ Resist in ink or film
form, with or without associated catalysts
|
Printed Circuit Boards.
|
|
30.
|
32, 38
|
Screen printing inks, dyes,
emulsions, lacquers, films (including sensitisers, hardeners, catalysts
|
Semi-conductor device, printed
circuit boards, potentiometer, capacitors, hybrid microcircuits, printed
parts, coils and inductors, resistors (other than heating resistors).
|
|
31.
|
32, 38
|
Internal Dag, Aqua Dag, Graphite, Hitasols, External
quoting Graphite or External Dag
|
Electronic Valves and Tubes.
|
|
32.
|
35, 39
|
Polyamide coatings or adhesives
|
Semi-conductor devices; Heat
sinks; deflection parts
|
|
33.
|
37,
|
Photo Polymer Film
|
Printed Circuit Boards; Liquid
Crystal Displays.
|
|
34.
|
37, 39
|
High resolution, high contrast photographic
films and photo stencil films; DIAZO (C6H5N2)
films
|
Printed Circuit Boards;
semi-conductor devices; hybrid microcircuits.
|
|
35
|
37, 70
|
High
Resolution Photo Plates; Photo mask Substrates
|
High Resolution Photo Marks;
Semi-conductor devices; Liquid Crystal Displays; Silicon Single Crystals or
Wafers. ��
|
|
36
|
37, 70
|
High resolution photo mask
|
Semi-conductor devices; Printed Circuit
Boards; Liquid Crystal Displays.� ��
|
|
37
|
38
|
Silicon in the form of undiffused
wafers, discs or chips
|
Semi-conductor devices.
|
|
38
|
38, 39, 76
|
Polyvinyl fluoride (TEDLAR);
Tedlar Aluminium Tedlar
|
Solar cells/modules.
|
|
39.
|
38, 81
|
Lithium niobate wafers
|
Hybrid microcircuits
|
|
40.
|
38, 85
|
Silicon in the form of diffused
wafers, discs or chips (with or without molybdenum disc)
|
Hybrid microcircuits or
semi-conductor devices.
|
|
41.
|
38, 85
|
Getters
|
Electronic valves and tubes
|
|
42.
|
39
|
Glass epoxy or/ and polyamide
prepregs
|
Multilayer Printed Circuit Boards;
copper clad laminates.
|
|
43.
|
39
|
Silicone rubber
|
Keypad switches; parts of EHT
transformers.
|
|
44.
|
39
|
Plain plastic films (other than
Polystyrene film) of thickness 12 microns or below; Metallised Plastic films
of thickness 12 microns or below
Explanation: For the
removal of doubts, �plain plastic film� includes bi-axially oriented
polypropylene (BOPP) film.
|
Plastic Film Capacitors or Mixed
Dielectric Capacitors, other than Power Capacitors
|
|
45.
|
39
|
Nylon 6.30% glass filled, flame
retardant moulding powder/ granules and with or without other additives
|
Potentiometers; connectors.
|
|
46.
|
39
|
Plain and glass filled nylon/
polyamide with or without other additives
|
Relays; Potentiometers; tape deck
mechanism; connectors.
|
|
47.
|
39
|
Polypropylene moulding powder/
granules
|
Deflection part; Cassettes.
|
|
48.
|
39
|
Polybutylene terephthalate
|
Connectors; deflection parts;
switches; relays.
|
|
49.
|
39
|
Heat shrinkable PVC sleeving,
tubing, film or ring
|
Capacitors; relays; deflection
parts.
|
|
50.
|
39
|
Polyurethane lapping pads
|
Mounted piezoelectric crystals;
Printed Circuit Boards; semi-conductor device; potentiometers; resistors
(other than heating resistors); connectors; switches; relays; tape deck
mechanisms; magnetic heads; deflection parts; DC Micromotors upto 13.5 volts
and not exceeding 20 watts rating; silicon (in all forms).
|
|
51.
|
39
|
Plain polystyrene film
|
Plain film capacitors; mixed
dielectric capacitors.
|
|
52.
|
39
|
Plain plastic film (other than
Polystyrene film) of thickness 12 microns or below.
Explanation: For
the removal of doubt, �plain plastic film� includes Biaxially Oriented
Polypropylene Film.
|
Electronic capacitor grade
metallised dielectric plastic film. ��
|
|
53.
|
39
|
Release film for multilayer
laminates
|
Printed Circuit Boards
|
|
54.
|
39, 40
|
Polyvinyl Alcohol,
Polyisobutylene, Chlorosulphonated Polyethylene (HYPALON)
|
Ferrites.
|
|
55.
|
39, 43
|
Antistatic materials in the form
of tubes, strips, mats, covers, bins, boxes, containers
|
Semi-conductor device, Hybrid
microcircuits
|
|
56.
|
39, 48, 59, 85
|
Insulating/taping material
(including pocket carrier tape) in tape, roll or strip form with or without
adhesive
|
Capacitors; deflection parts;
resistors (other than heating resistors); semi-conductor devices; inductors
|
|
57.
|
39, 48, 85
|
Domes or Dust caps; paper/ plastic
cones
|
Loudspeakers.
|
|
58.
|
39, 48, 85
|
Parts of Potentiometers
|
Potentiometers.
|
|
59.
|
39, 59, 73
|
Screen mesh of stainless steel/
polyester/ metallised polyester/ metallised nylon (in sizes of mesh 60 or
above)
|
Ceramic capacitors
|
|
60.
|
39, 69, 73, 85
|
Ceramic/ alumina substrates
|
Potentiometer; printed parts. ��
|
|
61.
|
74, 85
|
Parts of magnetic sound heads
|
Magnetic sound heads.
|
|
62.
|
39, 74
|
Copper clad laminates laminated to
nylon, teflon, polyester; Aluminium clad entry foil and back up laminates
|
Printed Circuit Boards.
|
|
63.
|
39, 85
|
Polyethylene terephthalate film
with ferro magnetic coating of thickness upto 0.005 inch with magnetic
coating 50 to 180 micro-inch
|
Floppy diskettes.
|
|
63A
|
39, 73
|
Moulded shell with liner, Steel
hub ring, spring, shutter
|
Floppy diskette (3.5� size)
|
|
64.
|
39, 85
|
Parts/articles of silicone,
Elastomer or Silicone rubber
|
Liquid Crystal Displays;
Semi-conductor Devices; EHT Transformers; Potentiometers; Electrolytic
Capacitors Solid tantalum capacitors. ��
|
|
65.
|
39, 85
|
Formers, bases, bobbins; Holders,
brackets; Shielding cases, cans
|
RF/IF coils or transformers or
deflection parts
|
|
66.
|
40, 59
|
Bungs; Rubber pinch rollers with
or without plastic bush
|
Electrolytic capacitors; tape deck
mechanisms.� ��
|
|
67.
|
40, 84, 85
|
Parts of Rotor Assembly;
Commutator assembly or parts thereof; Brush assembly or parts thereof
|
DC Micromotors upto 13.5 volts and
not exceeding 20 watts rating
|
|
68.
|
40, 85
|
Anode assembly consisting of EHT cable,
silicone rubber cap and contact spring or parts thereof (EHT cable in cut
pieces or running length)
|
Deflection parts.
|
|
69.
|
48,
|
Electrolytic Capacitor/ Condenser
Tissue paper
|
Electrolytic Capacitors; Plastic
Film Capacitors.
|
|
70.
|
48, 76
|
Kraft paper/ tissue paper or
aluminium foil for voice coil
|
Loud speakers (cone type).
|
|
71.
|
59
|
Felt sheet (fully compressed) of
1.5 mm thickness and below
|
Tape deck mechanism.
|
|
72.
|
69, 78, 85
|
Headers; Caps with or without
leads; Cans with or without leads; Pins; Stud seals; Lead beads; Ceramic
beads; Ceramic-glass packages; Cap to Lead Assembles; Ceramic Pipes; Lead
frames, single or in roll form; Housings; Brass ring
|
Semi-conductor devices; Light
Emitting Diodes; Resistors (other than heating resistors); Capacitors;
Connectors; Hybrid Microcircuits; Printed parts.
|
|
73.
|
69, 85
|
Alumina rods and bars (with
Alumina content above 90%) in coated or uncoated form; Ceramic plates/ flats/
cases/ bases/ formers; Steatite rods and bars in coated or uncoated form
|
Resistors (other than heating
resistors); Semi-conductor Devices; Hybrid Microcircuits; Electron Guns and
Electron Gun parts
|
|
74.
|
69, 85
|
Ceramic dielectric (coated or uncoated)
|
Ceramic capacitors.
|
|
75
|
70
|
Glass filament yarn
|
Silane treated glass cloth/fabric
for use in the copper clad laminates.
|
|
76.
|
32, 70, 85
|
Glass frit or glass powder; Glass
performs or pellets; Glass tubes
|
Liquid Crystal Display;
semi-conductor devices; Electronic valves and tubes (other than television
picture tube /cathode ray tubes); Glass to metal seals; Lead frames;
Transistor headers; Reed relays or Reed switches; delays lines; resistors
(other than heating resistors); mounted piezoelectric crystals; electron guns
and electron gun parts; gas discharge tubes. ����
|
|
77.
|
70, 85
|
Fused Quartzware
|
Semi-conductor devices; silicon in
all forms.
|
|
78.
|
71
|
Synthetic quartz crystal blocks and
blanks
|
Mounted Piezoelectric crystals.
|
|
79.
|
71
|
Contact tape with pure Nickel base
and Crown Gold alloy; Contact tape with solder Diamond Back in fine silver;
Contact tape in silver or silver alloy with or without palladium with Gold overlay
|
Relays; Switches.
|
|
80.
|
71
|
Gold in the form of wire, ribbon,
perform of purity 99.99% and above
|
Semi-conductor device; Light
Emitting Diodes
|
|
81.
|
71, 72, 75, 80
|
Nickel plated steel strip; tin
silver antimony alloy
|
Semi-conductor devices. ��
|
|
82.
|
71, 76, 85
|
Aluminum wire with silicon or
magnesium impurity of upto 2%; gold wire with phosphorous or antimony doping
|
Semi-conductor devices.
|
|
83.
|
72
|
CRNGO silicon steel strip/ sheet/ coil/
hoop with or without tin plating
|
DC Micromotor; Potentiometer;
Resistors.
|
|
84.
|
72
|
Coated/ uncoated
electro-galvanised CRCA/ mild steel/ stainless steel in the form of sheet/
strip/ wire/ coils
|
DC Micromotors; tape deck
mechanism.
|
|
85.
|
72, 73
|
Iron of 99.7% purity and above
|
Cast Alloy Permanent Magnets.
|
|
86.
|
72, 73, 75, 81
|
Nickel Iron Cobalt Alloy in all
forms
|
Semi-conductor devices; electronic
valves and tubes; transistor headers; glass to metal seals; lead frames; cast
alloy permanent magnets; hybrid microcircuits; gas discharge tubes.
|
|
87.
|
72 or 73
|
Copper clad tin coated steel wire,
dia 0.4 mm to 1.2 mm/ solder plated copper covered steel wire (SPC)
|
Lead tabs for electrolytic
capacitors.
|
|
88.
|
73, 85
|
Metal clad substrates in any form
with or without tags
|
Potentiometers; Hybrid
microcircuits; printed parts; semi-conductor devices; Light Emitting Diodes. ��
|
|
89.
|
74
|
Electrolytic Tough Pitch (ETP)
Copper wire rods
|
Lead wire for electronic parts.
|
|
90.
|
74
|
Solder plated/ unplated brass
strips upto 100 mm width; Silver plated brass strips upto 100 mm width
|
Potentiometers/ parts of
Potentiometers; connectors/ parts of connectors; switches/ parts of switches;
relays/ parts of relays.
|
|
91.
|
74
|
Phosphor Bronze Sheets/ bars/
sections/ flats/ strips/ wire/ rods/ foils/ pipes, with or without plating
|
Relays/ parts of relays; Tape Deck
Mechanism; Connectors/ parts of connectors; Potentiometers/ parts of
Potentiometers; Heat Sinks; cassettes; parts of cassettes; TV Tuner;
Telescopic antenna; Gas discharge tubes/ parts of gas discharge tubes.
|
|
92.
|
74
|
Beryllium Copper rods/ strips/
sheets/ wire/ foils with or without plating; Rectangular Profile Brass
material (CuZn39Pb2)
|
Connectors/ parts of connectors;
Relays/ parts of relays; Switches/ parts of switches; Gas discharge tubes/
parts of gas discharge tubes.
|
|
93.
|
74
|
Tin coated/ solder plated copper
wire
|
Resistors.
|
|
94.
|
74
|
Continuous cast copper wire rod/
copper scrap, electrolytic grade of purity 99.9% or above
|
Copper foil for copper clad
laminates.
|
|
95.
|
74, 76, 85
|
Copper-cadmium braided wire;
Self-soldering/ self-bonding aluminium wire
|
Loudspeakers; microphones.
|
|
96.
|
74, 85
|
Oxygen free high conductivity
(OFHC) Copper base with wieldable steel ring
|
Semi-conductor devices.
|
|
97.
|
74, 85
|
OFHC copper wire, bar, rods,
angles, shapes and sections, plates, sheets, strips, tubes and pipes
|
Semi-conductor devices; electronic
valves and tube transistor headers; glass to metal seals; capacitors.
|
|
98.
|
74, 85
|
Rayon or silk cover Litz wire of
the following sizes-
(a) 6, 8, 12 or 24 strands with
each strand diameter 0.03 mm;
(b) 6 or 9 strands with each
diameter 0.04 mm
|
RF/ IF Coils or transformers.
|
|
99.
|
74, 85
|
Parts made of OFHC copper
|
Semi-conductor devices, electronic
valves & tubes, transistor headers; glass to metal seals, capacitors.
|
|
100.
|
76
|
Etched or formed Aluminium Foils
|
Electrolytic Capacitors.
|
|
101.
|
76
|
Plain Aluminium foil containing
more than 99% Aluminium
|
Etched or formed Aluminium foil;
electrolytic capacitors or plastic film capacitors.
|
|
102.
|
76
|
Aluminum of purity 99% or above in
the form of wire, strips, sheets, rods, bar, pipes, plates, sections, ribbons
or shapes
|
Cans or leads for Electrolytic
Capacitors; Semi-conductor Devices; Light Emitting Diodes; Capacitors;
Capacitor grade Metallised Plastic films; Potentiometers; disc covers for
electrolytic capacitors.� ��
|
|
103.
|
81
|
Cobalt
|
Cast Alloy Permanent Magnets. ��
|
|
104.
|
81
|
High purity chromium powder
(99.99% and above)
|
Semi-conductor devices, Mounted
piezo electric crystals electronic valves and tubes, vacuum interruptor
tubes.
|
|
105.
|
81, 85
|
Molybdenum and molybdenum alloys,
wrought, in all forms and articles and parts thereof
|
Electronic Valves and Tubes; X-ray
tubes; Semi conductor Devices; Mounted Piezoelectric Crystals
|
|
106.
|
84, 85
|
Parts of Vacuum Interruptor Tubes
|
Vacuum Interruptor Tubes.
|
|
107.
|
85
|
Self bonding/ self soldering
insulated or enamelled copper wire
|
Deflection parts; Loudspeakers;
Relay; Magnetic Heads RF/ IF Coils, Transformers (other than Power Transformers)
and DC Micromotors upto 13.5 volts and not exceeding 20 watts rating;
electronic tuner ��
|
|
108.
|
85
|
Parts of gas discharge tubes
|
Gas discharge tubes
|
|
109.
|
85
|
Light Emitting Diodes in the form of
Chips. Wafers or undiced discs
|
Light Emitting Diodes; Lamps and
Displays
|
|
110.
|
85
|
Parts of Cathode Ray Tubes (other
than Glass parts)
|
Cathode Ray Tubes.
|
|
111.
|
85
|
Lead Tabs/ Paddle Tabs
|
Electrolytic Capacitors.
|
|
112.
|
85
|
Parts of Relays, Switches,
Connectors
|
Relays; Switches; Connectors.
|
|
113.
|
85
|
Parts of electron Guns
|
Electron Guns, Television picture
tubes or Cathode Ray Tubes.
|
|
114.
|
85
|
Casings of aluminium
|
Electrolytic capacitors.
|
|
115.
|
85
|
Parts of CD-Deck Mechanism
|
CD Deck Mechanism.
|
|
116.
|
85
|
Parts of Fly-back Transformer
|
Flyback Transformers
|
|
117.
|
85
|
Parts of Tuners
|
TV Tuners
|
|
118.
|
85
|
Parts of Data Cartridge
|
Data Cartridge.
|
|
119.
|
85
|
Parts of transmitting tubes
|
Transmitting tubes.
|
|
120.
|
85
|
Parts of deflection yoke (DY),
excluding colour deflection yoke core
|
Deflection part.
|
|
121.
|
|
Omitted
|
|
|
122
|
39, 74, 75, 76
|
Composite copper clad materials
consisting of Paper + Epoxy + Glass cloth
|
Printed Circuit Boards
|
|
123
|
74
|
Glass Epoxy Copper clad laminates
or Paper Phenolic Copper clad laminates
|
Printed Circuit Boards
|
|
124
|
74
|
Copper foils (plain or adhesive
coated)
|
Copper clad laminates (phenolic or
glass epoxy types); composite type copper clad laminates; multi-layer Printed
Circuit Boards
|
|
125
|
28, 29, 38, 72, 74, 84
|
�Cupric Chloride Etchant; Ammonical Etchants; Solid Carbide Drills;
Routers; Hot Air Levelling Flux; Electroless Copper Plating Solution;
Sensitisers; Activators; Post Activators; Copper foil of refined copper;
Colloidal/ Semi colloidal Graphite (Shadow)
|
Printed Circuit Boards
|
|
126
|
28, 29, 39, 68, 71, 81, 82
|
Plastic Film for Wafer Dicing;
Graphite Jigs/ Block/ Rods/ Plates; Dicing blades/ wheels; Tungsten filament
and or parts thereof; Tungsten Wire/ Rod; Colour Paste and Diffusants; Silver
conductive paste/ Suspension; Palladium Wire; n- Butyl Acetate; Bonding Tools
|
LED/ LED Displays; Semiconductor
Devices; Hybrid Microcircuits; Mounted Piezo Electric Crystals; Resistors;
Potentiometers
|
|
127
|
70, 85
|
Parts of data graphic display tubes
(colour), with a phosphor dot screen pitch smaller than 0.4mm
|
Data graphic display tubes
(colour), with a phosphor dot screen pitch smaller than 0.4mm
|
|
128
|
70, 75
|
Glass Tubes/ Insulators/ Spacers
|
Mounted piezo electric crystals
|
|
129
|
39
|
Diallylphthalate (DAP) Moulding
Powder or Compound (Plain or Glass/ Fibre filled with or without additives)
|
Connectors; Switches with contact
rating less than 5 amperes at voltage not exceeding 250 Volts AC or DC;
Potentiometers; Relays of contact rating upto 7 amperes; Resistors
|
|
130
|
39
|
Polyvinyl Chloride Film/ Sheet
|
Floppy Disks/ Diskettes
|
|
131
|
28, 38, 39
|
Gold plating make up and replenisher
solutions and salts; Resins for gold recovery
|
Semiconductor devices; LED/ LED
Displays; Connectors; PCBs
|
|
132
|
74
|
Solder Plated Annealed Copper Wire
(SCA) of diameter 0.4mm to 1mm
|
Plastic film capacitors
|
|
133
|
79
|
Zinc of purity 99% or above in
Rod, Wire or Strip form; Zinc Wire/ Zinc- Aluminium wire with dia up to 5mm;
Tin - zinc wire with dia upto 3mm
|
Electronic Capacitor Grade
Metallised Plastic Film/ Capacitors
|
|
134
|
80
|
Tin Foil/ Tin Alloy Foil
|
Plastic Film Capacitors; Resistors
(other than heating resistors)
|
|
135
|
76
|
Aluminium wire (of purity 99.9% or
above) of dia upto 3mm
|
Lead Wires/ Lead Tabs for
electrolytic capacitors; Electronic Capacitor grade Metallized Plastic film; Plastic
film capacitors; semiconductor devices
|
|
136
|
28
|
Barium Carbonate
|
Ceramic Capacitors
|
|
137
|
38, 39, 69
|
Hydroxy Propyl Methyl Cellulose
Barium Titanate based or Lead Titanate based Ceramic composition/ Powder
|
Ceramic Capacitors, Ceramic
Substrates/ Rods/ Discs/ Dielectric
|
|
138
|
28
|
Magnesium Oxide (Purity not less
than 98%); Zinc Oxide (Purity not less than 98%); Aluminium Oxide (Purity not
less than 99.9%); Vanadium Pentoxide (Purity not less than 99.9%); Lithium
Carbonate (Purity not less than 99%); Manganese Carbonate (Purity not less
than 98%); Bismuth Oxide (Purity not less than 99%); Cobalt Oxide (Purity not
less than 99%); Copper Carbonate (Purity not less than 98%); Chromium Oxide
(Purity not less than 98%); Indium Oxide (Purity not less than 99%);
Dysprosium oxide (Purity not less than 99%); Gadolinium Oxide (Purity not
less than 99%); Yttrium Oxide (Purity not less than 99.9%); Calcium Carbonate
(Purity not less than 98%); Tin Oxide (Purity not less than 98%); Magnesium
Carbonate (Purity not less than 99%); Iron Oxide (Purity not less than 99%);
Barium Carbonate (Purity not less than 99%)
|
Resistors; Ceramic Capacitors
|
|
139
|
39, 48, 59
|
�Resin -VAGH Co-Polymerised Vinyl Chloride
Vinyl Acetate, Pressure Sensitive felt, with or without adhesive, Silicon
Coated/ Carbonized silicon paper
|
Magnetic Tapes/Cassettes
|
|
140
|
39
|
Polyimide Film (Kapton)
|
IC Sockets (Connectors);
Resistors; Potentiometers; Semiconductor devices
|
|
141
|
39
|
Modified Polyphenylene Oxide
|
Deflection Components;
potentiometers
|
|
142
|
39
|
Phenolic Moulding Powder/ Resin
|
Resistors; Potentiometers;
Capacitors; Hybrid Micro-circuits
|
|
143
|
72, 74
|
Lead wires of Iron or non alloy
steel plated or coated with other base metals
|
Resistors; Potentiometers; Plastic
Film Capacitors; Lead Tabs of Electrolytic Capacitors
|
|
144
|
29, 72, 74, 76, 85
|
Copper alloy resistance wire and
strips; Steel or Aluminium in substrate or sheet form; Butyl DiGol
|
Resistors; Potentiometers
|
|
145
|
81
|
Metal alloy targets
|
Resistors; Resistor Grade
Metallized Ceramic Cores
|
|
146
|
85
|
Chip Transistors; Varicap Diodes
|
Tuners; Modulators; Hybrid Micro
Circuits
|
|
147
|
74
|
Cladded Copper/ Copper Alloy
Strip/ Foil
|
Switches with contact rating less than
5 amperes at voltage not exceeding 250 Volts AC or DC; Connectors
|
|
148
|
28
|
Zinc Oxide (Purity minimum 99.5%);
Strontium Oxide/ Strontium Carbonate; Zinc Stearate (Purity minimum 99%);
Polyvinyl alcohol (PVA); Polyvinyl Butyral (Ash Content max 1%)
|
Pre-Calcined Ferrite Powder (Spray
Dried); Resistors
|
|
149
|
28
|
Zirconium Oxide (Purity not less
than 99%); Tin Oxide (Purity not less than 99%); Lanthanam Oxide (Purity not less
than 99%); Zinc Oxide (Purity not less than 98%); Polystyrene (Purity not
less than 98%); Magnesium Oxide (Purity not less than 98%); Calcium Carbonate
(Purity not less than 98%); Tantalum Oxide (Purity not less than 99%); Barium
Carbonate (Purity not less than 99%)
|
Microwave Dielectrics; Ceramic
Capacitors; Resistors; Varistors; Thermistors
|
|
150
|
39
|
Phenolic Moulding Powder/ Resin
|
Hybrid Micro circuits;
Potentiometers; Ceramic Capacitors; Thermistors; Varistors; Switches with contact
rating less than 5 amperes at voltage not exceeding 250 Volts AC or DC;
Connectors
|
|
151
|
39, 69
|
�Guide Ceramic; Guide LCP (Liquid Crystal Polymer)
|
Print heads
|
|
152
|
85
|
Parts of Loudspeaker
|
Loudspeakers
|
|
153
|
74, 85
|
High Voltage Rectifier Diodes;
Focus Potmeter; Electrolytic Tough Pitch Wire/ Rods/ Formed Pins/ parts made
thereof
|
Deflection Components
|
|
154
|
39
|
Polycarbonate (Plain or glass
filled moulding powder)
|
Resistors; Potentiometers; Switches
with contact rating less than 5 amperes at voltage not exceeding 250 Volts AC
or DC
|
|
155
|
39
|
Poly Vinyl Acetate��������
|
Resistors; Potentiometers; Hybrid
Micro Circuits
|
|
156
|
72
|
Nickel Iron (low carbon/ gas free grade)
in Sheet or strip form/ EB Welded Triple Metal Strips/ Controlled Expansion
Alloy Strips
|
Resistors; Potentiometers;
|
|
157
|
39
|
SRBP (Synthetic Resin Bonded
Paper) Sheets and Substrates
|
Potentiometers; Switches with contact
rating les than 5 amperes at voltage not exceeding 250 Volts AC or DC
|
|
158
|
25
|
Ball Clay
|
Ceramic Cores/ Substrates for
resistors
|
|
159
|
32
|
Borosilicate Glass Powder
|
Parts of Electron Gun/ Multiform
Bead Glass Rods
|
|
160
|
74
|
Unplated Brass Strips in Coil form
70 mm width; Phosphor Bronze Strips in Coil Form
|
Connectors
|
|
161
|
72, 74
|
Bimetal sheets in coil forms/
piece parts; Copper clad steel sheets in coil forms/ piece parts
|
Relays of contact rating upto 7
amperes
|
|
162
|
28, 29
|
�Ammonium Dihydrogen Phosphate; Ammonium pantaborate
|
Electrolytic Capacitors
|
|
163
|
38
|
Carbon/ Flurographite Powder
|
Potentiometers
|
|
164
|
28, 34
|
Boron Nitride Suspension; Metallisation
Inhabitation Fluid (Oil)
|
Electronic Capacitor Grade
metallised Plastic Film/ Plastic Film Capacitors
|
|
165
|
29
|
Dowanol PX-16S (Non- CFC solvent)
|
Flyback Transformers/ Focus
Resistors
|
|
166
|
28, 29, 38, 48
|
Monoalkylethers of ethylene
glycol.; Flux 1544; Ammonium Hydroxide (CMOS Grade); Ammonia (Np) (CMOS
Grade); Lid perform; Chemcassette
|
Semiconductor devices
|
|
167
|
76
|
Etched Aluminium Foil
|
Formed Aluminium Foil for
electrolytic capacitors
|
|
168
|
29, 32, 38, 39, 71
|
DBE Solvent; DMH Solvent; Printing Inks; Protective U.V.
Lacquer; Dyes; Optical grade polycarbonate; Methyl Lactate; OFP; Cake Box;
BOPP Film; Jewel box; Silver Sputtering Target
|
CD-R (Unrecorded CD)
|
|
LIST B
|
|
1.
|
28
|
Litharge
|
Glass shells/ parts for colour
picture tubes.
|
|
2.
|
28
|
Gamma Ferric Oxide
|
Magnetic links or Magnetic Tape.
|
|
3.
|
38.
|
Precalcined/ Pre-sintered ferrite
powder
|
Ferrites
|
|
4.
|
58, 69,
84, 85
|
Molybdenum Sillicide/ Molybdenum
disillicide heating elements; Conveying trays; Saggers
|
Ferrites
|
|
5.
|
39, 74,
75, 76
|
Composite copper clad materials
consisting of Paper + Epoxy + Glass cloth
|
Printed Circuit Boards
|
|
6.
|
74
|
Glass Epoxy Copper clad laminates
or Paper Phenolic Copper clad laminates
|
Printed Circuit Boards
|
|
7.
|
74
|
Copper foils (plain or adhesive
coated)
|
Copper clad laminates (phenolic or
glass epoxy types) Composite type copper clad laminates; multi-layer printed
circuit boards
|
|
LIST C
|
|
1.
|
Omitted
|
|
2.
|
Omitted
|
|
3.
|
Omitted
|
|
4.
|
Omitted
|
|
5.
|
70
|
TV Glass bulbs/ shells; CRT Glass
Bulbs/shells; Magnetron Glass bulbs/shells
|
Television picture tubes, Cathode
Ray tubes or magnetrons.
|
|
6.
|
70
|
Glass parts for colour picture
(excluding neck or re-neck tubes)
|
Colour picture tubes.
|
|
7.
|
70
|
Parts of TV/ CRT Glass bulb/ shells
including panels, funnels, Glass tubes (excluding neck or reneck tubes)
|
TV Glass bulbs/ shell for TV
Picture tube or CRT Glass bulbs/ shells for CRT.
|
|
8.
|
70
|
Neck or reneck tubes
|
CRT Glass bulbs/ shells for CRT.
|
|
9.
|
Omitted
|
|
10.
|
Omitted
|
|
|
|
|
|
|