Sl.
No.
|
Sub
Heading No.
|
Description
|
(1)
|
(2)
|
(3)
|
1.
|
7017.10
or 7020.00
|
Quartz
reactor tubes and holders designed for insertion into diffusion and
oxidation furnaces for production of semi-conductor wafers.
|
2.
|
8419.89
|
Chemical
vapour deposition apparatus for semi-conductor production.
|
3.
|
8419.90
|
Parts
of Chemical vapour deposition apparatus for semi-conductor production.
|
4.
|
8421.19
|
Spin
dryers for semi-conductor water processing.
|
5.
|
8421.91
|
Parts
of Spin Dryers for semi-conductor wafer processing.
|
6.
|
8424.89
|
Deflash
machines for cleaning and removing contaminants from the metal leads of
semiconductor packages prior to the electroplating process.
|
7.
|
8424.89
|
Spraying
appliances for etching, stripping or cleaning semi-conductor wafers.
|
8.
|
8424.90
|
Parts
of spraying appliances for etching, stripping or cleaning semiconductor
wafers.
|
9.
|
8456.10
|
Machines
for working any material by removal of material, by laser or other light
or photo beam in the production of semiconductor wafers.
|
10.
|
8456.91
|
Machine
tools for working any material by removal of material, by laser or other
light or photon beam, ultrasonic, electro-discharge, electro-chemical,
electron beam, ionic-beam or plasma arc processes, for dry-etching
patterns on semiconductor materials of the said First Schedule.
|
11.
|
8456.99
|
Focussed
ion beam milling machines to produce or repair masks and reticles for
patterns on semiconductor devices.
|
12.
|
8456.99
|
Laser
cutters for cutting contacting tracks in semiconductor production by
laser beam.
|
13.
|
8464.10
|
Machines
for sawing monocrystal semiconductor boules into slices, or wafers into
chips.
|
14.
|
8464.20
|
Grinding,
polishing and lapping machines for processing of semiconductor wafers.
|
15.
|
8464.90
|
Dicing
machines for scribing or scoring semiconductor wafers.
|
16.
|
8466.91
|
Parts
of grinding, polishing and lapping machines for processing of
semiconductor wafers.
|
17.
|
8466.91
|
Parts
of machines for sawing monocrystal semiconductor boules into slices, or
wafers into chips.
|
18.
|
8466.91
|
Parts
of dicing machines for scribing or scoring semiconductor wafers.
|
19.
|
8466.93
|
Parts
of focussed ion beam milling machines to produce or repair masks and
reticles for patterns on semiconductor devices.
|
20.
|
8466.93
|
Parts
of machines for working any material by removal of material, by laser or
other light or photo beam in the production of semiconductor wafers.
|
21.
|
8466.93
|
Parts
of machines for dry-etching patters on semiconductor materials.
|
22.
|
8466.93
|
Parts
of laser cutters for cutting contacting tracks in semiconductor
production by laser beam.
|
23.
|
8466.93
|
Parts
of apparatus for stripping or cleaning semiconductor wafers.
|
24.
|
8477.10
or 8479.89
|
Encapsulation
equipment for assembly semiconductors.
|
25.
|
8477.90
or 8479.90
|
Parts
of encapsulation equipment for assembly of semiconductors.
|
26.
|
8479.50
|
Automated
machines for transport, handling and storage of semiconductor wafers,
cassettes, wafer boxes and other material for semiconductor devices.
|
27.
|
8479.89
|
Apparatus
for growing or pulling monocrystal semiconductor boules.
|
28.
|
8479.89
|
Epitaxial
deposition machines for semiconductor wafers.
|
29.
|
8479.89
|
Apparatus
for physical deposition by sputtering on semiconductor wafers.
|
30.
|
8479.89
or 8543.30
|
Apparatus
for wet-etching, developing, stripping or cleaning semiconductor wafers
and flat panel displays.
|
31.
|
8479.89
|
Die-attach
apparatus, tape automated bonders and wire bonder for assembly of
semiconductors.
|
32.
|
8479.89
|
Machines
for bending, folding and straightening semiconductors leads.
|
33.
|
8479.89
|
Physical
deposition apparatus for semiconductor production.
|
34.
|
8479.89
|
Spinners
for coating photographic emulsions on semiconductor wafers.
|
35.
|
8479.90
|
Parts
of apparatus for growing or pulling monocrystal semiconductor boules.
|
36.
|
8479.90
|
Parts
of Epitaxial deposition machines for semiconductor wafers.
|
37.
|
8479.90
|
Parts
of apparatus for physical deposition by sputtering on semiconductor
wafers.
|
38.
|
8479.90
|
Parts
for die attach apparatus; tape automated bonders and wire bonders for
assembly of semiconductors.
|
39.
|
8479.90
|
Parts
of spinners for coating photographic emulsions on semiconductor wafers.
|
40.
|
8479.90
or 8543.90
|
Parts
of apparatus for wet-etching, developing, stripping or cleaning
semiconductor wafers and flat panel displays.
|
41.
|
8479.90
|
Parts
of automated machines for transport, handling and storage of
semiconductor wafers, wafer cassettes, wafer boxes and other material
for semiconductor devices.
|
42.
|
8479.90
|
Parts
of machines for bending, folding and straightening semiconductor leads.
|
43.
|
8479.90
|
Parts
of physical deposition apparatus for semiconductor production.
|
44.
|
8480.71
|
Injection
compression moulds for manufacture of semiconductor devices.
|
45.
|
8514.10
|
Resistance
heated furnaces and ovens for the manufacture of semiconductor devices
on semiconductor wafers.
|
46.
|
8514.20
|
Inductance
or dielectric; furnaces and ovens for the manufacture of semiconductor
devices on semiconductor wafers.
|
47.
|
8514.30
|
Parts
of resistance heated furnace and ovens for the manufacture of
semiconductor devices on semiconductor wafers.
|
48.
|
8514.30
|
Apparatus
for rapid heating of semiconductor wafers.
|
49.
|
8514.90
|
Parts
of furnaces and ovens of heading Nos. 8514.10
to 8514.30
|
50.
|
8514.90
|
Parts
of apparatus for rapid heating of wafers.
|
51.
|
8543.11
|
Ion
implanters for doping semiconductor materials.
|
52.
|
8543.89
or 9017.20
|
Pattern
generating apparatus of a kind used for producing masks or reticles from
photo-resist coated substrates.
|
53.
|
8543.90
|
Parts
of ion implanters for doping semiconductor materials.
|
54.
|
8543.90
or 9017.90
|
Parts
and accessories of pattern generating apparatus of kind used for
producing masks or reticles from photo-resist coated substrates.
|
55.
|
9010.41,
9010.42 or 9010.49
|
Apparatus
for the projection or drawing of circuit patterns on sensitised
semiconductor material.
|
56.
|
9010.90
|
Parts
and accessories of the apparatus of heading No. 9010.41
to 9010.49
|
57.
|
9011.10
|
Optical
stereoscopic microscopes fitted with equipment specifically designed for
the handling and transport of semiconductor wafers or reticles.
|
58.
|
9011.20
|
Photo
micrographic microscopes fitted with equipment specifically designed for
the handling and transport of semiconductor wafers or reticles.
|
59.
|
9011.90
|
Parts
and accessories of optical stereoscopic microscopes fitted with
equipment specifically designed for the handling and transport of
semiconductor wafers or reticles.
|
60.
|
9011.90
|
Parts
and accessories of Photo micrographic microscopes fitted with equipment
specifically designed for the handling and transport of semiconductor
wafers or reticles.
|
61.
|
9012.l0
|
Electron
beam microscopes fitted with equipment specifically designed for the
handling and transport of semiconductor wafers or reticles.
|
62.
|
9012.90
|
Parts
and accessories of electron beam microscopes fitted with equipment
specifically designed for the handling and transport of semiconductor
wafers or reticles.
|
63.
|
|
Omitted
|
64.
|
9030.90
|
Parts
and accessories of instruments and apparatus and parts of appliances for
measuring or checking semiconductor wafers of devices.
|
65.
|
9031.41
|
Optical
instruments and appliances, for inspecting semiconductor wafers or
devices or for inspecting photomasks or reticles used in manufacturing
semiconductor devices.
|
66.
|
9031.49
|
Optical
instruments and appliances for measuring surface particulate
contamination on semiconductor wafers.
|
67.
|
9031.90
|
Parts
and accessories of optical instruments and appliances for inspecting
semiconductor wafers or devices or for inspecting masks, photomasks or
reticles used in manufacturing semiconductor devices.
|
68.
|
9031.90
|
Parts
and accessories of optical instruments and appliances for measuring
surface particulate contamination on semiconductor wafers.
|